Senior Engineer II, Electronics Hardware Technical Lead

Job Summary

Lead definition, decomposition, and validation of hardware requirements from system and stakeholder inputs (functional, electrical, environmental, safety, regulatory). Establish and enforce bi-directional traceability from stakeholder system hardware design artifacts verification validation (V-model).

Responsibilities

• Requirements Engineering Traceability Lead definition, decomposition, and validation of hardware requirements from system and stakeholder inputs (functional, electrical, environmental, safety, regulatory).
• Establish and enforce bi-directional traceability from stakeholder system hardware design artifacts verification validation (V-model).
• Product Development Leadership Translate requirements into architectural choices and design constraints for PCBs, power, analog/mixed-signal, and environmental constraints.
• Collaborate with Electrical Design, Layout, and FW to ensure requirements are feasible, cost-optimized, and testable.
• Align requirements with DFx (DFT/DFM/DFR), EMI/EMC, safety (e. g. , IEC/UL), thermal, and reliability objectives.
• Guide teams through FMEA, FTA, worst-case analysis (WCA), tolerance analysis, derating, and component selection aligned to lifecycle and obsolescence plans.
• Atleast lead min 1 product end to end responsibility from Design to Release to Market.
• Experience on ATS (Auto Transfer Switch) controller development is added advantage.

Must-Have Qualifications

• 10-14 years of hands-on hardware development experience, including: Analog design (low-noise, precision, sensor interfaces, signal integrity).
• Power supply design AC/DC and DC-DC flyback, Full bridge etc.
• Mixed-signal systems (ADC integration, grounding, isolation strategies).
• Digital design (MCUs, FPGAs, high-speed logic, clocking architectures).
• Deep understanding of PCB design and hardware architecture, including: Multi-layer PCB stack-up planning.
• EMI/EMC-aware layout practices.
• Thermal-aware design and component placement.
• Worst Case Analysis (WCA), derating, and tolerance stack-up analysis.
• Simulation tools (SPICE, SI tools).
• Pre-compliance and certification test strategies.
• Strong hardware debugging and root-cause analysis capability: System-level issue isolation across analog, digital, and power domains.
• Experience resolving EMI/EMC failures, field issues, and production escapes.
• Component selection based on performance, cost, and availability.
• Obsolescence risk mitigation and second sourcing.
• Supplier technical interaction and qualification.

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