Job Summary

The Mixed Signal Development Group is responsible for delivering high-speed analog and mixed-signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for wireline applications. From PCIe to 128+Gb/s SERDES, we enable technology that allows Microchip's products to interface to the outside world.

As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team manager, and be engaged in the package design and layout.

Responsibilities

Conduct package routing feasibility and substrate layouts for Microchip high-speed products, including MCM packages
Perform simple PCB breakout studies for ball map feasibility
Identify key issues for proposed designs based on silicon floor plans and desired package sizes
Work with signal integrity engineers to implement high speed signal routes and quiet power routes
Work with reliability engineers and external vendors to ensure manufacturability of package designs
Create package routing constraints based on signal integrity routing rules
Interact with and oversee work of external and internal package designers
Produce package routing reports and diagrams for review by external teams
Create and track package design schedules
Guide and assist external design teams on creation of input data for package design flow.

Requirements/Qualifications

Applicable Bachelor's or Master's Degree
10+ years of industry experience
Expert in package design using Cadence APD
Expert in authoring APD design rules
Scripting in PERL or SKILL is an asset
Familiarity with flip chip and wire bond package designs
Familiarity with PCB design and BGA fanout issues
Understanding of high speed and power routing rules/issues
Capable of handling multiple tasks at once
Customer oriented, with attention to detail

Travel Time

0% - 25%

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

Principal, IC Package Engineer

Job Description

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